BAKU, Azerbaijan, July 29. Qualcomm has signed a long-term agreement to supply semiconductor technology for BMW's future vehicle platforms, providing chips for digital cockpit systems and advanced driver-assistance technologies through the next decade.
The companies said the partnership will use Qualcomm's Snapdragon Digital Chassis platform, including cockpit processors, automated driving chips and artificial intelligence accelerators, to serve as the hardware foundation for BMW's next-generation AI-powered vehicles.
The agreement comes as competition in the autonomous and intelligent vehicle market continues to intensify, with companies such as Nvidia and Mobileye also seeking to expand their presence in automotive chip and software platforms.
Financial terms of the deal were not disclosed.
Qualcomm has been steadily expanding beyond its traditional smartphone chip business, investing heavily in automotive electronics, including infotainment systems, connectivity solutions and advanced driver-assistance technologies.
Nakul Duggal, Qualcomm's Group General Manager for Automotive, Industrial and Embedded IoT and Robotics, said the collaboration would help both companies shape the future of intelligent mobility as AI technologies become increasingly integrated into vehicles.
The new agreement builds on an existing partnership under which Qualcomm's Snapdragon Ride Pilot system was introduced in BMW's electric iX3, enabling features such as hands-free highway driving, automatic lane changes and parking assistance.
